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In automated PCB assembly, which consequence results when electrostatic discharge (ESD) occurs during component placement?

A)Latent circuit damage increases
B)Solder bridge formation reduces
C)Pick-and-place accuracy improves
D)Throughput of high-mix assemblies increases

💡 Explanation

Latent circuit damage increases because ESD introduces a surge in a susceptible circuit, causing microscopic failures via dielectric breakdown; therefore reliability decreases, rather than directly causing immediate functional failure, although solder bridges are related to the soldering process.

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