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Which consequence arises when excessive thermal vibration weakens adhesive molecular bonds?

A)Increased creep rate observed
B)Reduced electromigration occurrence there
C)Enhanced passivation layer formation
D)Increased piezoelectric coefficient measured

💡 Explanation

Increased creep rate results because thermally activated bond breakage via Arrhenius equation facilitates atomic movement; this is called Atomic diffusion. Therefore, creep increases rather than reduced electromigration because electromigration is driven by electron flow.

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