Which consequence results when repeated thermal cycling weakens solder bonds in integrated circuits?

💡 Explanation

Increased junction temperatures develop because thermo-mechanical fatigue causes crack propagation within the solder. The increasing thermal resistance from the reduced contact area exacerbates heat dissipation; therefore a positive feedback loop results rather than inhibited heat transfer.

• Which outcome increases when operating a high-voltage transformer at 500 kHz, exceeding its designed resonant frequency?
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