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← ScienceWhich consequence results when thermal runaway occurs during solder reflow?
A)Insufficient wetting, creating brittle joints
B)Bridging between closely spaced pads
C)Delamination due to differential expansion✓
D)Oxidation of PCB copper trace surfaces
💡 Explanation
Differential expansion causes delamination because layers separate during thermal runaway; the excessive heat overwhelms temperature control. Therefore, delamination is the answer given excessive heat, rather than insufficient wetting due to inadequate heat or oxidation, which reduces solderability.
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