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Which failure arises when rapidly switching a high-voltage IGBT gate?

A)Increased device leakage current
B)Catastrophic thermal runaway develops
C)Gate oxide dielectric breakdown
D)Elevated electromagnetic interference emissions

💡 Explanation

Applying high dV/dt to the gate-source capacitance causes displacement current injection stressing the gate oxide; therefore dielectric breakdown can occur because high field strengths are present rather than a thermal event like runaway.

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