Which mechanism limits the maximum operating temperature of an epoxy adhesive bond in a silicon integrated circuit?

💡 Explanation

When heated above its glass transition temperature (Tg), an epoxy adhesive bond transitions from a rigid to a rubbery state, causing a reduction in its modulus and significant reduction holding strength because the polymer chains gain mobility. Therefore the glass transition reduces bond strength, rather than hydrolysis, expansion or metal migration, which occur through different processes at lower temperatures.

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