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Which outcome commonly occurs due to trapped-hole injected gate dielectric stress?

A)Increased MOSFET threshold voltage drift
B)Reduced channel electron injection current
C)Improved gate oxide breakdown strength
D)Stabilized interface trap density increase

💡 Explanation

Increased MOSFET voltage threshold drift stems from quantum tunneling; electrons tunnel through the gate oxide because charge builds there, altering the electric field. Therefore, option A is correct, rather than the other results, which can all improve device behavior under these conditions.

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