Live Quiz Arena
🎁 1 Free Round Daily
⚡ Enter ArenaQuestion
← ScienceWhich outcome during plasma etching arises when ion angular distribution broadens?
A)Increased micro-trenching at feature sidewalls✓
B)Enhanced oxide selectivity over silicon
C)Decreased etch rate uniformity cross-wafer
D)Improved critical dimension etch bias
💡 Explanation
Micro-trenching increases because ion angular distribution affects the angle at which ions strike the surface, causing non-uniform material removal. The mechanism is momentum transfer from ions to substrate atoms; therefore it leads to micro-trenching rather than other effects because these are caused by isotropic etching.
🏆 Up to £1,000 monthly prize pool
Ready for the live challenge? Join the next global round now.
*Terms apply. Skill-based competition.
Related Questions
Browse Science →- Which consequence occurs when stellar inertial frames become equivalent?
- Which outcome will observers measure when subjected to extreme gravitational differentials?
- Which optical effect occurs when monochromatic light bounces between the parallel glass slides of a Fabry-Pérot interferometer?
- Which outcome occurs when applying a gate voltage altering ZnO nanowire orbitals?
- Which outcome results when doping silicon within tunnel diodes?
- Which outcome occurs when rapid decompression triggers flash freezing?
