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Which process limits copper interconnect downscaling on chips?

A)Increased electron scattering boundary confinement
B)Reduced skin effect current density
C)Enhanced electromigration diffusion rate
D)Elevated parasitic capacitance gate coupling

💡 Explanation

The increased electron scattering results from boundary confinement as dimensions shrink. This is because the reduced feature size forces electrons to scatter more frequently off of the interconnect boundaries, therefore resistivity increases, rather than a constant conductivity independent of size.

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