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Which risk during pulsed laser deposition worsens when fluence increases?

A)Substrate surface plasma formation
B)Increased epitaxial film crystallinity
C)Reduced target material ablation
D)Improved thin film stoichiometry

💡 Explanation

Plasma formation rises with increased pulse energy, because higher laser fluence causes rapid heating via inverse Bremsstrahlung of free carriers, therefore, resulting in surface damage rather than uniform film growth.

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