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Which risk increases when a pulsed laser etches a target?

A)Plasma formation above the surface
B)Material tensile strength improves
C)Heat diffusion lowers ablation rate
D)Specular reflection decreases linearly

💡 Explanation

Plasma formation risk is high because the intense laser energy causes rapid ionization of the ablated material. This leads to dielectric breakdown, therefore creating a hot plasma above the target, rather than controlled heating of the substrate material.

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