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Which risk increases when an engineer shrinks a flash memory cell below 10nm?

A)Data retention time reduction
B)Increased static power dissipation
C)Elevated write endurance failures
D)Catastrophic dielectric gate breakdown

💡 Explanation

Data retention suffers because quantum tunneling allows electrons to escape the floating gate through the thin oxide layer. Therefore, retention time is reduced, rather than increased power leakage or dielectric breakdown, which are related, but separate failure modes.

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