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Which risk increases when back-pressure elevates during chemical vapor deposition?

A)Reduced precursor deposition rate
B)Enhanced substrate crystalline uniformity
C)Improved exhaust gas condensation
D)Increased pump vibrational dampening

💡 Explanation

Reduced deposition rate occurs when back-pressure elevates because increased pressure reduces mass transport of reactant gases towards rather than away from deposition surfaces. Lower mass transport, therefore, lowers reaction rate near the active growth sites, and reduces overall thin-film growth rate.

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