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Which risk increases when metallic grain boundaries migrate during annealing?

A)Reduced resistance to creep deformation
B)Increased resistance to crack propagation
C)Elevated Hall Effect coefficient values
D)Suppressed Bardeen–Cooper–Schrieffer pairing

💡 Explanation

Reduced creep resistance results because grain boundary migration weakens the metal's structure through Coarsening. The driving mechanism is grain boundary energy minimization, therefore the metal becomes softer rather than harder, enhancing crack resistance, or altering electronic properties.

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