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Which risk increases when pulsed-laser ablation heats ceramic?

A)Undesired thermal stress cracking occurs
B)Increased specular reflective loss appears
C)Plasma shielding inhibits etch rate
D)Self-focusing distorts the Gaussian profile

💡 Explanation

Thermal stress cracking increases because rapid local heating during pulsed-laser ablation induces differential expansion exceeding the material's fracture strength due to increased *thermomechanical coupling*; therefore cracking appears, rather than excess reflection because the energy is primarily absorbed.

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