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Which risk increases when the sacrificial layer oxidizes during microfabrication of a MEMS gyroscope?

A)Critical dimension errors
B)Delamination probability reduces
C)Fabrication costs decrease largely
D)Release etch becomes faster

💡 Explanation

Critical dimension errors increase because isotropic etching is compromised by uneven oxide thickness that forms; conformal oxide inhibits the designed undercut, therefore the etching proceeds non-uniformly rather than releasing evenly under microstructures.

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