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Which risk increases when thermal expansion closes a semiconductor band gap?

A)Increased electron-hole recombination rate
B)Increased resonant vibration frequency
C)Decreased piezoelectric sensor accuracy
D)Decreased material fracture toughness

💡 Explanation

A narrowing band gap increases thermal excitations, thus increasing the electron-hole recombination rate because smaller energies trigger electron movement via band gap narrowing. Therefore recombination increases, rather than decreased accuracy because thermal expansion drives energy changes.

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