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Which risk significantly increases when a PCB's parasitic capacitance oscillates near resonance?

A)Conductor trace thermal runaway
B)Substrate glass transition softening
C)Bond wire intermetallic whisker growth
D)Component solder joint cold creep

💡 Explanation

When a PCB's parasitic capacitance resonates, substantial current loops form. Joule heating occurs due to increased current density; therefore, conductor trace thermal runaway risk increases, rather than bond failures, because resistance in traces is typically lower than in bond wires.

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