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Which outcome occurs when rapid sublimation cools electronics?

A)Icing risk increases considerably
B)Thermal runaway risk appears rapidly
C)Corrosion accelerates significantly in metals
D)Dendrite formation is reduced rapidly

💡 Explanation

Icing risk increases considerably because rapid sublimation absorbs substantial latent heat, therefore ambient moisture freezes quickly on surfaces, rather than remaining liquid due to lowered temperature and energy transfer from environment.

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