Which risk increases when integrated circuits experience electromigration at elevated temperatures?

💡 Explanation

Kirkendall voids and material clustering increase because electromigration causes atoms to diffuse along the crystal lattice due to high current densities. This uneven flux forms voids, therefore creating failure rather than enhanced structure or stable dopant diffusion.

• Which outcome limits Stirling engine efficiency during isothermal phases?
• Which risk increases when the laser power drifts upward in differential interference contrast (DIC) microscopy?
• Which consequence results when event horizon distance decreases?
• Which outcome occurs when a high-intensity laser ablates a crystalline silicon wafer?
• Which outcome is observed when applying significant pressure to a piezoelectric crystal?
• Which consequence results when isotopic enrichment processes accelerate?