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Which risk increases concerning the gate-source junction insulation within gallium nitride (GaN) HEMTs operating at elevated temperatures?

A)Increased gate leakage current
B)Drain current saturation falloff
C)Lowered channel mobility drift
D)Elevated on-resistance instability

💡 Explanation

Increased temperature accelerates trap creation near the gate-source junction, and trap-assisted tunneling becomes dominant; therefore, elevated leakage increases, rather than ohmic resistance changes, because tunneling probability exponentially depends upon trap density.

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