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Which risk increases during electronic device manufacturing when gate oxide layers become extremely thin?

A)Increased quantum tunneling current
B)Reduced electron mobility in channel
C)Enhanced thermal conductivity of oxide
D)Lower dielectric breakdown strength

💡 Explanation

When gate oxide layers become very thin, quantum tunneling increases because electrons can directly tunnel through the potential barrier, increasing leakage current. Therefore increased tunneling current results, rather than mobility reduction, thermal conductivity enhancement, or dielectric breakdown, which are separate effects with different mechanisms.

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